Compact footprint, modular design.
Multiple chemical compatibility for cleaning, stripping, etching; high chemical utilization.
Scalable single-wafer chamber with optimal flow design and particle control.
RCA
Metal Etch
Single Etch
Ultra-thin Clean
Back Side Clean
MEMS Metal Strip
Wafer Back Thinning
High stability
Max WPH~400
Modular design
Optimized transfer system
Tel
Global